Join Nissha ecosense at PACK EXPO International (Chicago) 2026

Nissha to Exhibit at PACK EXPO International (Chicago) 2026 – October 18th – 21st , at Booth #W-49012.

Nissha will be exhibiting at PACK EXPO International (Chicago) 2026, held at the McCormick Place Chicago, IL from October 18th to 21st, 2026, at Booth #W-49012. We will showcase our complete lineup of “ecosense” sustainable packaging solutions, including Pulp-Injection, Paperfoam®, Pulp-Molding, and Sulapac®.

Our pulp-based packaging technology utilizes an injection molding process to create unique, highly customized shapes as a sustainable alternative to conventional plastic trays and boxes. It delivers the product protection and premium user experience required by the pharmaceutical, medical, CPG and consumer electronics industries, while offering recyclability and biodegradability. Our exhibit will feature a broad range of applications, including premium packaging for high-end wearable devices, injector trays for pharmaceutical products, and heat-sealed packaging solutions for CPG applications.

Learn more about the award-winning product

Sulapac® is a bio-based composite made from wood chips of various sizes and a plant-based binder, all sourced from sustainably managed forests. Nissha offers standard jar formats in avariety of sizes and colors with low minimum order quantities (MOQ)—ideal for candies,supplements, and cosmetics.

Explore our ecosense product range

ecosense product information